Apparatus and methods for brush and pad conditioning

ABSTRACT

A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the invention relate to electronic device manufacturing.In particular, embodiments relate to a scrubber box for cleaning and/orpolishing thin discs such as semiconductor substrates, wafers, compactdiscs, glass substrates and the like.

2. Description of the Related Art

Brush cleaning apparatus, sometimes referred to as scrubbers or scrubberboxes, are often utilized to polish and/or clean semiconductorsubstrates at one or more stages of an electronic device manufacturingprocess. For example, a cleaning device using cylindrical rollers havinga pad material or a brush body disposed thereon may be caused to contactat least one major surface of a substrate to remove material from themajor surface of the substrate. In one typical process, a cylindricalroller having a pad material disposed thereon is caused to rotate andurged against a rotating substrate to polish the substrate using achemical mechanical polishing (CMP) process. In another typical process,a cylindrical roller having a brush body disposed thereon is caused torotate and urged against a rotating substrate to clean the substrateafter a CMP process.

The processing surface of the pad material or brush body disposed on thecylindrical rollers in these devices tend to wear over time, whichdecreases removal rate or cleaning efficiency. Thus, the pad material orbrush bodies may need to be replaced frequently in order to achievedesirable polishing or cleaning results. Replacement of the pad materialor brush bodies is costly and causes downtime, which results in highercost of ownership and lower throughput.

As the demand for integrated circuits continue to rise, chipmanufactures have demanded semiconductor process tooling have increasedthroughput and more robust processing equipment. To meet such demands,apparatus and methods are being developed to maximize throughput,increase the service life of tool components, and decrease the cost ofownership.

What is needed is an apparatus and method for refreshing the processingsurface of the pad material or the brush body disposed on thecylindrical rollers to obviate wear of the surface, remove agglomeratedmaterials from the surface, as well as extend the useful lifetime of thepad material or the brush body.

SUMMARY OF THE INVENTION

Embodiments described herein relate to a method and apparatus forconditioning a processing surface of a cylindrical roller disposed in abrush box that is part of a substrate polishing system or a substratecleaning system. In one embodiment, a brush box is described. The brushbox includes a tank having an interior volume and a pair of cylindricalrollers at least partially disposed in the interior volume, each of thecylindrical rollers being rotatable about a respective axis, an actuatorassembly coupled to each of the cylindrical rollers to move therespective cylindrical roller between a first position where thecylindrical rollers are in proximity to each other and a second positionwhere the cylindrical rollers are spaced away from each other, and aconditioning device for each of the cylindrical rollers, eachconditioning device including a conditioner disposed in the interiorvolume, the conditioner contacting an outer surface of each of thecylindrical rollers when the rollers are in the second position.

In another embodiment, a brush box is described. The brush box includesa tank having an interior volume and a pair of cylindrical rollersdisposed in the interior volume, each of the rollers being rotatableabout a respective first axis, an actuator assembly coupled to each ofthe cylindrical rollers to move the respective roller between a firstposition where the rollers are in proximity to each other and a secondposition where the rollers are spaced away from each other, aconditioning device for each of the rollers, each conditioning deviceincluding a conditioner disposed in the interior volume, eachconditioner contacting an outer surface of each of the cylindricalrollers when the rollers are in the second position, and eachconditioner being rotatable about a second axis that is different thanthe first axis.

In another embodiment, a method for processing a substrate is described.The method includes transferring a substrate to a tank, positioning thesubstrate between two cylindrical rollers disposed in the tank, movingeach of the two cylindrical rollers into a first position where aprocessing surface of each of the cylindrical rollers contacts majorsurfaces of the substrate, processing the substrate by providingrelative motion between at least one of the two cylindrical rollers andthe substrate, moving each of the two cylindrical rollers to a secondposition that is spaced apart from the major surfaces of the substrate,the second position including contacting the processing surface with aconditioning device, and transferring the substrate out of the tankwhile conditioning the processing surface.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above-recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 is an isometric view of a scrubber box.

FIG. 2A is a top view of the scrubber box of FIG. 1 showing thecylindrical rollers in a substrate processing position.

FIG. 2B is a top cross-sectional view of the scrubber box of FIG. 2Ashowing the cylindrical rollers in a substrate transfer position.

FIG. 3A is a top view of one embodiment a conditioning device.

FIG. 3B is a side cross-sectional view of the cylindrical roller and theconditioner of FIG. 3A.

FIG. 3C is a side cross-sectional view of another embodiment of aconditioning device.

FIG. 4A is a top view of another embodiment a conditioning device.

FIG. 4B is a cross-sectional view of the cylindrical roller and theconditioner of FIG. 3A.

FIG. 5A is a top view of another embodiment a conditioning device.

FIG. 5B is a cross-sectional view of the cylindrical roller and theconditioner of FIG. 5A.

FIG. 6 is a flowchart showing one embodiment of a conditioning method.

FIG. 7 is a flowchart showing one embodiment of a substrate processingmethod.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements disclosed in oneembodiment may be beneficially utilized on other embodiments withoutspecific recitation.

DETAILED DESCRIPTION

Embodiments described herein generally provide an apparatus and methodfor conditioning or refreshing a processing surface of a pad material ora brush body disposed on a cylindrical roller in a brush-type cleaningsystem that is utilized in a scrubber box. Embodiments of scrubber boxthat may be adapted to benefit from the invention include a cleaningmodule that is part of a SYCAMORE™ polishing system and a DESICA®cleaner, both available from Applied Materials, Inc., located in SantaClara, Calif. Embodiments described herein may also be utilized onbrush-type cleaning and polishing systems available from othermanufacturers. Additionally, while the embodiments of scrubber boxes aredescribed to process a substrate in a vertical orientation, someembodiments may be utilized in scrubber boxes configured to process asubstrate in a horizontal orientation.

FIG. 1 is an isometric view of a scrubber box 100 that may be utilizedin a cleaning module as described above. The scrubber box 100 includes atank 105 that is at least partially encased in a first support 125 and asecond support 130. Each of the supports 125, 130 are coupled to alinkage 110 that is external to (i.e., outside of) the tank 105 of thescrubber box 100. Each of the supports 125, 130 are adapted to supportan actuator 135. Each actuator 135 is coupled to a cylindrical roller115, 120 (shown in FIG. 2A) located inside the tank 105. The actuators135 provide rotational movement of the respective cylindrical rollers115, 120 about axes A′ and A″. Each of the actuators 135 may be drivemotors, such as direct drive servo motors adapted to rotate therespective cylindrical rollers 115, 120 about axes A′ and A″. Each ofthe actuators 135 are coupled to a controller adapted to control therotational speed of the cylindrical rollers 115, 120.

The linkage 110 is coupled to each of the supports 125, 130, a base 140,and an actuator 145. The linkage 110 is utilized for convenient andaccurate actuation/movement of the cylindrical rollers 115, 120 locatedinside the tank 105 relative to the major surfaces of a substrate 101(shown in FIG. 2). Additionally, clearance holes (not shown) may beformed in the tank 105 to achieve rotational coupling between thebrushes 115, 120, actuators 135 and the supports 125, 130. A compliantcoupling element 150, such as a flexible washer, a seal or a bellows,may be disposed around each hole and mounted between the tank 105 andthe supports 125, 130. Such an arrangement (1) permits relative motionof the cylindrical rollers 115, 120 relative to the walls of the tank105; (2) protects the substrate 101 against particulate contaminationthat might otherwise pass into the interior of the tank 105 through theholes in the tank walls; and/or (3) permits a fluid level in the tank105 to reach or exceed the level of the holes while preventing fluidfrom draining therethrough. The actuator 145 is coupled to thecontroller to control the movement of the linkage 110.

Each of the first and second supports 125, 130 are coupled to the base140 by a pivot point 112 to which the first and second supports 125, 130may be adapted to pivot (upward and inward toward one another, and/ordownward and outward away from one another). In operation, the first andsecond supports 125, 130 may be moved simultaneously through respectivearcs 146 ₁, 146 ₂, as shown in FIG. 1, relative to the base 140. Suchmovement may cause the first and second cylindrical rollers 115, 120 toclose against the substrate 101 as shown in FIG. 2A, or to cause thefirst and second cylindrical rollers 115, 120 to be spaced apart (shownin FIG. 2B) to allow insertion and/or removal of the substrate 101 fromthe scrubber box 100.

FIG. 2A is a top view of the scrubber box 100 of FIG. 1 showing thecylindrical rollers 115, 120 in a processing position where thecylindrical rollers 115, 120 are closed or pressed against majorsurfaces of the substrate 101. FIG. 2B is a top view of the scrubber box100 of FIG. 2A in a transfer position where the cylindrical rollers 115,120 are spaced apart to facilitate transfer of the substrate. Thescrubber box 100 also includes one or more drive motors 144 and arotational device 147. Each of the drive motors 144 and rotationaldevice 147 are coupled to a roller assembly configured to support and/orengage the substrate 101 and facilitate rotation of the substrate 101.

Each of the cylindrical rollers 115, 120 include a tubular cover 128disposed thereon. The tubular cover 128 may be a removable sleeve madeof a pad material utilized to polish the substrate 101 or a brush bodyadapted to clean the substrate 101.

Examples of the pad material that may be utilized as the tubular cover128 include polymeric pad materials typically utilized in chemicalmechanical polishing (CMP) processes. The polymeric material may be apolyurethane, a polycarbonate, fluoropolymers, PTFE, PTFA, polyphenylenesulfide (PPS), or combinations thereof. The pad material may furthercomprise open or closed cell foamed polymers, elastomers, felt,impregnated felt, plastics, and like materials compatible with theprocessing chemistries. In another embodiment, the pad material is afelt material impregnated with a porous coating.

Examples of a brush body that may be utilized as the tubular cover 128include polymeric materials, such as foams (e.g., polyvinyl alcohol(PVA), polyurethane) as well as thermoplastic materials or polyamidematerials, such as nylon. The tubular cover 128 may further include aplurality of raised features, nodules or bristles (not shown) utilizedto abrade the substrate 101 and effect cleaning of the substrate 101.

Depending on the specific material of the tubular cover 128, cleaningand/or polishing effectiveness of the processing surface of the tubularcover 128 is generally dependent on a suitable porosity and average poresize. In some embodiments, the porosity of the processing surface of thetubular cover 128 may be greater than about 85%. Other characteristicsof the tubular cover 128 include a desirable average pore size oropening. The pore size opening in some embodiments range from about 10microns to about 200 microns. The pore structures effect cleaning ormaterial removal from the feature side of the substrate. Attributes suchas polishing compound retention, polishing or removal activity, andmaterial and fluid transportation also affect removal rate.

In order to facilitate optimal removal of material from the substrate,these microscopic pores must be fully and evenly open to provide arelatively high and stable removal rate and/or a maximized cleaningefficiency. These pore structures, when open, facilitate materialremoval by enhancing processing surface wetability, maintainingprocessing surface roughness, and dispersing polishing compounds, suchas, for example, abrasive particles supplied from a polishing compound.

In the process of removing materials from the substrate in the polishingor cleaning process, the processing surface of the tubular cover 128becomes worn and removed materials, chemicals, and other by productsbecome attached to the processing surface of the tubular cover 128. Inorder to maintain the cleaning and/or polishing efficiency of thetubular cover 128, the tubular cover 128 may be replaced, which iscostly and time consuming. Alternatively, the processing surface of thetubular cover 128 may be periodically conditioned or refreshed toenhance the processing surface of the tubular cover 128

FIGS. 2A and 2B depict one embodiment of a conditioning device 200 thatmay be utilized to condition and/or refresh the processing surface ofthe tubular cover 128 disposed on each of the cylindrical rollers 115,120. In this embodiment, a dedicated conditioning device 200 is providedfor each of the cylindrical rollers 115, 120 but only one conditioningdevice 200 may be utilized. The conditioning device 200 is mountedadjacent a sidewall 205 of the tank 105 by one or more support members210. The conditioning device 200 is positioned away from the center ofthe tank 105 so the conditioning device 200 does not interfere withsubstrate transfer and/or substrate polishing or cleaning processes.However, the conditioning device 200 is positioned to contact each ofthe cylindrical rollers 115, 120 when the first and second supports 125,130 are actuated downward and outward away from one another. In oneembodiment, the movement of the first and second supports 125, 130brings the cylindrical rollers 115, 120 into contact with a respectiveconditioning device 200. When the cylindrical rollers 115, 120 are inthis position, the processing surface of the tubular cover 128 disposedon each of the cylindrical rollers 115, 120 may be conditioned bycausing relative movement between the cylindrical rollers 115, 120 andthe conditioning device 200.

In one embodiment, the cylindrical rollers 115, 120 rotate aboutrespective first axes A′ and A″ relative to the conditioning device 200.The rotational direction of axes A′ and A″ may be the same or different.For example, the rotational direction of a first axis A′ and a secondaxis A″ may both be clockwise or counterclockwise. Alternatively, therotational direction of the first axis A′ may be clockwise and therotational direction of the second axis A″ may be counterclockwise, orvice versa. In another embodiment, the conditioning device 200 may becaused to rotate relative to each of the cylindrical rollers 115, 120based on movement or axial rotation of the cylindrical rollers 115, 120.In another embodiment, both of the conditioning device 200 and thecylindrical rollers 115, 120 may be rotated independently.

The conditioning device 200 is an article configured to clean, abrade orenhance the processing surface of the tubular cover 128 by mechanicalcontact with the tubular cover 128. In one embodiment, the conditioningdevice 200 is an abrasive article made of an abrasive material and/orincludes abrasive particles such as a diamond or ceramic material.Alternatively, the conditioning device 200 may be made from a materialthat is harder than the hardness of the processing surface of thetubular cover 128. Examples include glass, silicon materials,thermoplastics, process compatible metals, such as aluminum or tungsten,among other materials. The outer surface of the conditioning device 200may be roughened to enhance abrasion of the processing surface of thetubular cover 128. In this embodiment, each conditioning device 200 isan elongated cylindrical or tubular member. In other embodiments, eachconditioning device 200 may be configured as a flat or cylindrical brushhaving bristles or a disk-shaped member.

FIG. 3A is a top view of one embodiment a conditioning device 200 havinga conditioner 300 in contact with a processing surface 301 of a tubularcover 128 disposed on a cylindrical roller 115. In this embodiment, theconditioner 300 is in the form of a cylindrical rod or tube 302. In oneembodiment, the conditioner 300 includes a roughened outer surface 303adapted to abrade the processing surface 301 of the tubular cover 128.In one embodiment, the outer surface 303 of the conditioner 300 includesa plurality of abrasive particles 305.

In this embodiment, the conditioner 300 is adapted to rotate relative tothe cylindrical roller 115. The conditioner 300 is coupled to supportmembers 210 on each end by a spindle 312. The spindles 312 allowrotation of the conditioner 300 relative to the support members 210 andthe cylindrical roller 115. The conditioner 300 may be adapted to rotatebased on the rotation of the cylindrical roller 115 or the conditioner300 may be caused rotate independent of the cylindrical roller 115. Inone embodiment, the conditioner 300 is coupled to an actuator 315 thatrotates the conditioner 300 about an axis B, which may be referred to asa third axis B. In one embodiment, the conditioner 300 may be rotatedwhile the cylindrical roller 115 is stationary. In another embodiment,the conditioner 300 may be rotated about axis B while the cylindricalroller 115 is rotated about axis A″. In one aspect, the rotational axesA″ and B are substantially parallel. In one embodiment, the rotationaldirection of axes A′ and A″ may both be clockwise or counterclockwise.Alternatively, the rotational direction of axis A′ may be clockwise andthe rotational direction of axis A″ may be counterclockwise, or viceversa. In another embodiment, the rotational direction of axis B may beclockwise or counterclockwise and the rotational movement may beindependent of the rotation of the cylindrical rollers 115, 120. In yetanother embodiment, rotational force to any or all of the cylindricalrollers 115, 120 and the conditioner 300 may be pulsed on and off,varied to change the rotational speed, and/or intermittently reversed.

FIG. 3B is a cross-sectional view of the cylindrical roller 115 and theconditioner 300 of FIG. 3A. The conditioner 300 includes a core 320,which may be a shaft disposed on the longitudinal axis of theconditioner 300. The core 320 may be coupled to the spindles 312 (FIG.3A). The cylindrical roller 115 includes a mandrel assembly 316 thatincludes tubular core 317 on the longitudinal axis of the cylindricalroller 115. The tubular core 317 is in communication with a plurality ofradial conduits 318 extending from the tubular core 317 to a peripheryof the cylindrical roller 115. In one embodiment, the tubular core 317is coupled to a fluid source 319 that provides a cleaning or polishingfluid to the tubular cover 128 through the radial conduits 318 duringprocessing of a substrate. In another embodiment, the fluid source 319provides a fluid to the tubular cover 128 during conditioning to enhancecleaning of the processing surface 301. In this embodiment, the fluidsource 319 provides a liquid or a gas to the tubular cover 128 throughthe radial conduits 318. In one embodiment, the fluid may be deionizedwater (DIW), inert gases such as argon, nitrogen, helium, among otherfluids that may facilitate removal of material from the processingsurface 301.

FIG. 3C is a side cross-sectional view of another embodiment of aconditioning device 200 having a housing 325 that encloses or surroundsat least a portion of the conditioner 300. The housing 325 includeswipers 328 that are adapted to contact the processing surface 301 of thetubular cover 128. In one embodiment, the wipers 328 include bristlesand/or abrasives (not shown) that are utilized to abrade the processingsurface 301. In this embodiment, the wipers 328 may be utilized with orwithout the conditioner 300. For example, in one embodiment, the wipers328 may be utilized as a conditioning device without the need for theconditioner 300. In another embodiment, the wipers 328 are utilized withthe conditioner 300 to contain any materials produced by theconditioning process. In this embodiment, the wipers 328 are made of aflexible or compliant material adapted to conform to the topography ofthe processing surface 301 of the tubular cover 128. Depending on theuse of the wipers 328 with or without the conditioner 300, materials forthe wipers 328 include rigid materials such as ceramics, glass,thermoplastics as well as more compliant materials, such as polymers,plastics, silicon, elastomers and rubber.

In one embodiment, the housing 325 encloses a negative pressure region335. In this embodiment, the housing 325 is in fluid communication witha vacuum pump 330 adapted to generate or maintain negative pressure inthe region 335. In this embodiment, the wipers 328 are configured ascompliant seals to contain negative pressure within the housing 325.Cleaning of the processing surface 301 may be enhanced by suction fromthe vacuum pump 330. Material removed from the processing surface 301 ofthe tubular cover 128 as well as any fluids may be removed from theinterior of the housing 325 and routed to a waste or abatement system.

FIG. 4A is a top view of another embodiment a conditioning device 200having a conditioner 400 in contact with a processing surface 301 of atubular cover 128 disposed on a cylindrical roller 115. In thisembodiment, the conditioner 400 is configured as a brush or comb havinga bar-shaped structural member 402 that spans the length of thecylindrical roller 115. Each end of the structural member 402 is coupledto a support member 210. In this embodiment, one or both of the supportmembers 210 are coupled to a linear actuator 415 adapted to providepressure to one or both ends of the structural member 402. In thismanner, a pressure or force between the conditioner 400 and theprocessing surface 301 of the tubular cover 128 may be varied. Inoperation, the cylindrical roller 115 is rotated about axis A″ while theconditioner 400 is controllably urged against the processing surface 301of the tubular cover 128.

FIG. 4B is a cross-sectional view of the cylindrical roller 115 and theconditioner 400 of FIG. 3A. In one embodiment, the conditioner 400includes a plurality of raised features 405 that may be bristles,abrasive particles, structural protrusions, or combinations thereof.While not shown, the conditioner 400 may be enclosed by a housing thatis in communication with a vacuum pump as shown in FIG. 3C.

FIG. 5A is a top view of another embodiment a conditioning device 200having a conditioner 500 in contact with a processing surface 301 of atubular cover 128 disposed on a cylindrical roller 115. In thisembodiment, the conditioner 500 includes a disk-shaped body 502 coupledto a support member 510 at a geometric center of the body 502. In thisembodiment, the support member 510 is adapted as an axle that is coupledto an actuator 515 utilized to rotate the body 502 about axis C. In thisembodiment, the tank 105 may be provided with a lid (not shown) to allowthe interior volume of the tank 105 to contain negative pressureprovided by a vacuum pump 330. As the material is removed from theprocessing surface 301 of the tubular cover 128, the removed materials,as well as any fluids, may be removed from the interior of the tank 105and routed to a waste or abatement system.

FIG. 5B is a cross-sectional view of the cylindrical roller 115 and theconditioner 500 of FIG. 5A. The conditioner 500 includes an outersurface 503 that may be roughened in order to abrade the processingsurface 301 of the tubular cover 128. In one embodiment, the outersurface 503 includes a plurality of raised features 505 that may bebristles, abrasive particles, structural protrusions, or combinationsthereof.

In this embodiment, the conditioner 500 is adapted to rotate relative tothe cylindrical roller 115. The conditioner 500 is coupled to thesupport member 510 to facilitate rotation of the body 502 relative tothe cylindrical roller 115. The conditioner 500 may be adapted to rotatebased on the rotation of the cylindrical roller 115 or the conditioner500 may be caused rotate independent of the cylindrical roller 115. Inone embodiment, the conditioner 500 is coupled to the actuator 515 thatrotates the body 502 about axis C, which may be referred to as a fourthaxis C. In one embodiment, the body 502 may be rotated while thecylindrical roller 115 is stationary. In another embodiment, the body502 may be rotated about axis C while the cylindrical roller 115 isrotated about axis A″. In one aspect, the rotational axis A″ issubstantially normal to the rotational axis C.

FIG. 6 is a flowchart showing one embodiment of a conditioning method600 using the conditioning device 200 as described herein. At 610, oneor both of the cylindrical rollers 115, 120 having a processing surface301 are positioned to contact a conditioner, such as the conditioner300, 400 or 500 as described herein. At 620, relative motion is providedbetween the processing surface 301 and the conditioner. The relativemotion may be provided by rotating the cylindrical roller 115, 120relative to the conditioner, rotating the conditioner relative to thecylindrical roller 115, 120, or a combination thereof.

FIG. 7 is a flowchart showing one embodiment of a substrate processingmethod 700 using the scrubber box 100 as described herein. At 710, asubstrate is transferred to a tank 105 to a position between twocylindrical rollers 115, 120. At 720, each of the two cylindricalrollers 115, 120 are urged toward the substrate into a first positionthat facilitates contact between a processing surface 301 of thecylindrical rollers 115, 120 and major surfaces of the substrate. Duringstep 720, the cylindrical rollers 115, 120 and the substrate may becaused to rotate relative in order to perform a cleaning or polishingprocess.

At 730, the cylindrical rollers 115, 120 are moved to a second positionthat spaces the cylindrical rollers 115, 120 away from the substrate tofacilitate transfer of the substrate. The second position also includescontacting the processing surface of each of the cylindrical rollers115, 120 with a conditioning device, which may be the conditioner 300,400, or 500 as described herein. A conditioning method as described inFIG. 6 may be performed while the substrate is transferred out of thetank 105. The conditioning method may continue until another substrateis transferred into the tank 105 and the method may repeat beginning atstep 710.

Embodiments of the conditioning device 200 as described herein extendsthe lifetime of the processing surface 301 of a tubular cover 128utilized on the cylindrical rollers 115, 120 of a scrubber box 100. Theuse of the conditioning device 200 provides in-situ conditioning of theprocessing surface 301 of the cylindrical rollers 115, 120 such that thecylindrical rollers 115, 120 do not need to be removed from the tank105. In one embodiment, the processing surface 301 of new or unusedtubular covers 128 may be conditioned in a break-in process that isperformed in the scrubber box 100. Using the conditioning device 200 ina break-in process minimizes or eliminates the need for dummy wafers andsaves time. Additionally, the conditioning of the processing surface 301of the cylindrical rollers 115, 120 during substrate transfer processesdoes not affect throughput of the scrubber box 100. The conditioningdevice 200 as described herein also maintains an optimal processingsurface 301 of the tubular cover 128 by opening pores and removingagglomerated and/or excess material from the processing surface 301. Theoptimal processing surface 301 increases removal rate or cleaningefficiency and minimizes replacement frequency of the tubular cover 128.Thus, cost of ownership is minimized while throughput is maximized.

While the foregoing is directed to embodiments of the invention, otherand further embodiments of the invention may be devised withoutdeparting from the basic scope thereof.

1. A brush box, comprising: a tank having an interior volume and a pairof cylindrical rollers at least partially disposed in the interiorvolume, each of the cylindrical rollers being rotatable about arespective axis; an actuator assembly coupled to each of the cylindricalrollers to move the respective cylindrical roller between a firstposition where the cylindrical rollers are in proximity to each otherand a second position where the cylindrical rollers are spaced away fromeach other; and a conditioning device for each of the cylindricalrollers, each conditioning device including a conditioner disposed inthe interior volume, the conditioner contacting an outer surface of eachof the cylindrical rollers when the rollers are in the second position.2. The brush box of claim 1, wherein the conditioner is coupled to asidewall of the tank by one or more support members.
 3. The brush box ofclaim 2, wherein the conditioner is fixed to the sidewall of the tank bythe one or more support members.
 4. The brush box of claim 2, whereinthe conditioner is rotatably coupled to the sidewall of the tank by theone or more support members.
 5. The brush box of claim 4, wherein theone or more support members are coupled to an actuator.
 6. The brush boxof claim 5, wherein the cylindrical rollers are rotatable about a firstaxis and a second axis, the first axis being different than and parallelto the second axis.
 7. The brush box of claim 6, wherein the actuatorrotates the conditioner about a third axis that is substantiallyparallel to the first or second axis.
 8. The brush box of claim 6,wherein the actuator rotates the conditioner about a fourth axis that issubstantially normal to the first or second axis.
 9. The brush box ofclaim 1, wherein the conditioner comprises a cylindrical tube.
 10. Thebrush box of claim 1, wherein the conditioner comprises a bar.
 11. Thebrush box of claim 1, wherein the conditioner comprises a disk.
 12. Thebrush box of claim 1, wherein the conditioning device further comprises:a housing disposed around the conditioner.
 13. The brush box of claim12, wherein the housing is coupled to a vacuum pump.
 14. The brush boxof claim 12, wherein the housing includes at least one wiper adapted tocontact the outer surface of the cylindrical roller in the secondposition.
 15. A brush box, comprising: a tank having an interior volumeand a pair of cylindrical rollers disposed in the interior volume, eachof the rollers being rotatable about a respective first axis; anactuator assembly coupled to each of the cylindrical rollers to move therespective roller between a first position where the rollers are inproximity to each other and a second position where the rollers arespaced away from each other; a conditioning device for each of therollers, each conditioning device including a conditioner disposed inthe interior volume, each conditioner contacting an outer surface ofeach of the cylindrical rollers when the rollers are in the secondposition, and each conditioner being rotatable about a second axis thatis different than the first axis.
 16. The brush box of claim 15, whereineach conditioner is rotatably coupled to the sidewall of the tank by oneor more support members.
 17. The brush box of claim 16, wherein the oneor more support members are coupled to an actuator.
 18. The brush box ofclaim 17, wherein the actuator rotates the conditioner about the secondaxis, the second axis being substatintally parallel to the first axis.19. The brush box of claim 17, wherein the actuator rotates theconditioner about the second axis, the second axis being substantiallynormal to the first axis.
 20. The brush box of claim 15, wherein theconditioning device further comprises: a housing disposed around theconditioner.
 21. The brush box of claim 20, wherein the housing iscoupled to a vacuum pump.
 22. The brush box of claim 20, wherein thehousing includes at least one wiper adapted to contact the outer surfaceof the cylindrical roller in the second position.
 23. A method forprocessing a substrate, comprising: transferring a substrate to a tank;positioning the substrate between two cylindrical rollers disposed inthe tank; moving each of the two cylindrical rollers into a firstposition where a processing surface of each of the cylindrical rollerscontacts major surfaces of the substrate; processing the substrate byproviding relative motion between at least one of the two cylindricalrollers and the substrate; moving each of the two cylindrical rollers toa second position that is spaced apart from the major surfaces of thesubstrate, the second position including contacting the processingsurface with a conditioning device; and transferring the substrate outof the tank while conditioning the processing surface.
 24. The method ofclaim 23, further comprising: providing relative motion between theprocessing surface and the conditioning device.
 25. The method of claim24, wherein providing relative motion comprises moving the processingsurface relative to the conditioning device.
 26. The method of claim 24,wherein providing relative motion comprises rotating the conditioningdevice relative to the processing surface.
 27. The method of claim 26,wherein providing relative motion comprises rotating the conditioningdevice relative to the processing surface.
 28. The method of claim 27,wherein providing relative motion comprises: rotating the conditioningdevice in a first rotational direction while rotating the processingsurface in a second rotational direction that is different than thefirst rotational direction.
 29. The method of claim 28, wherein thefirst rotational direction is substantially parallel to the secondrotational direction.
 30. The method of claim 28, wherein the firstrotational direction is substantially normal to the second rotationaldirection.